Publications by IMPACT Members


Author Title Publication Name
Liang-Teck Pang, Kun Qian, Costas J. Spanos and Borivoje NikolicMeasurement and Analysis of Variability in 45 nm Strained-Si CMOS TechnologyIEEE Journal of Solid-State Circuits, Volume 44, Issue 8, Aug. 2009 Page(s):2233 - 2243
M. J. Titus, Dustin G Nest and D. B. GravesModelling Vacuum Ultraviolet Photon Penetration Depth and CO bond depletion in 193 nm PhotoresistJ. Appl. Phys D: Fast Track Communication (2009)
G. Leray, P. Chabert, A.J. Lichtenberg and M.A. LiebermanFluid Model of an Electronegative Discharge with Magnetized Electrons and Unmagnetized IonsJ. Phys. D: Appl. Phys. 42 (2009) 194020
Tuck-Boon Chan, Puneet GuptaOn Electrical Modeling of Imperfect Diffusion PatterningIEEE/ACM International Conference on VLSI Design 2010
Lerong Cheng, Puneet Gupta, and Lei HeOn Confidence in Characterization and Application of Variation ModelsAssian and South Pacific Design Automation Conference 2010
Tuck-Boon Chan, Rani S. Ghaida, Puneet GuptaElectrical Modeling of Lithographic ImperfectionsIEEE/ACM International Conference on VLSI Design 2010
Jemin Park and Chenming HuAir-Spacer MOSFET with Self-Aligned Contact for Future Dense MemoriesIEEE Electron Device Letters 2009
M. J. Titus, Dustin G Nest and D. B. GravesAbsolute vacuum ultraviolet flux in inductively coupled plasmas and chemical modifications of 193 nm photoresistAppl. Phys. Letters 2009
Kwangok Jeong, Andrew B. Kahng, and Rasit O. TopalogluA Framework for Chip-Level Evaluation of Misalignment and Linewidth Error Impacts Across Double Patterning Technology OptionsInternational Workshop on Design for Manufacturability and Yield, 2009
Jan B. Talbot, Fiona M. Doyle and David A. DornfeldParticle-Scale Modeling of CMPICPT2009, Fukuoka, Japan, Nov. 2009
Kwangok Jeong, Andrew B. Kahng, and Rasit O. TopalogluIs Overlay Error More Important Than Interconnect Variations in Double PatterningProc. ACM International Workshop on System-Level Interconnect Prediction, 2009
N. Brahma, M.C. Chan, and J.B. TalbotEffect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina ParticlesECS Transactions, Chemical Mechanical Polishing 10, The Electrochemical Society Meeting, San Francisco, CA (May 2009)
Mohit Gupta, Kwangok Jeong, and Andrew B. KahngTiming Yield-Aware Color Reassignment and Detailed Placement Perturbation for Double Patterning LithographyInternational Conference on Computer-Aided Design 2009
Darsen D. Lu, Chung-Hsun Lin, Shijing Yao, Weize Xiong, Florian Bauer, Cloves R. Cleavelin, Ali M. Niknejad and Chenming HuDesign of FinFET SRAM Cells using a Statistical Compact Model2009 Simulation of Semiconductor Processes and Devices (SISPAD)
N. Brahma, M. C. Chan, J. B. TalbotEffect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina ParticlesECS Transactions - San Francisco, CA, Volume 19 Chemical Mechanical Polishing 10
Yu Ben, Laurent El Ghaoui, Kameshwar Poolla, Costas J. SpanosChance-constrained Digital Circuit SizingESSCIRC 2009
Dominic Reinhard and Puneet GuptaOn Comparing Conventional and Electrically Driven OPC TechniquesSPIE/BACUS Photomask Technology 2009
Rani S. Ghaida and Puneet GuptaA Framework for Early and Systematic Evaluation of Design RulesInternational Conference on Computer-Aided Design (ICCAD) 2009
Rani S. Ghaida, George Torres, and Puneet GuptaSingle-Mask Double-Patterning LithographySPIE/BACUS Photomask Technology 2009
Yu Ben, Laurent El Ghaoui, Kameshwar Poolla, Costas J. SpanosDigital Circuit Sizing via Robust Approximation3rd IEEE International Workshop on DFM 2009
Nuo Xu, Xin Sun, Lynn Wang, Andrew Neureuther, Tsu-Jae King LiuPredictive Compact Modeling for Strain Effects in Nanoscale Transistors2009 International Conference on Simulation of Semiconductors Process and Devices (SISPAD)
Tripathi, S., Monvoison, A., Dornfeld, D., and Doyle, F.CMP Modeling as Part of Design for ManufacturingProc. ICPT, 2007, Dresden, Germany
David DornfeldDesign for Manufacturing Opportunities in CMP ModelingProc.2008 CMP-MIC, Fremont CA, March 2008
David DornfeldOpportunities and Challenges to Sustainable Manufacturing and CMPProc. MRS Spring Meeting, San Francisco, April 14-16, 2009
Shantanu Tripathi, Fiona M. Doyle, and David A. DornfeldFundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents2009 MRS spring meeting
Shantanu Tripathi, Seungchoun Choi, Fiona M. Doyle, and David A. DornfeldIntegrated Tribo-Chemical Modeling of Copper CMP2009 MRS spring meeting
H. Xu and K. KomvopoulosA Three-Dimensional Stochastic Analysis of the Lapping Process Used for Magnetic Recording HeadsProceedings of ASME/STLE International Joint Tribology Conference, Memphis, TN, Paper No. IJTC2009–15176, 2009
H. Xu and K. KomvopoulosA Probabilistic Analysis of Third-Body Embedment – Implications in Lapping of Magnetic Recording HeadsProceedings of STLE/ASME International Joint Tribology Conference, Miami, FL, Paper No. IJTC2008–71242, 2008
A. B. Kahng, C.-H. Park, X. Xu and H. YaoRevisiting the Layout Decomposition Problem for Double Patterning LithographyProc. BACUS Symposium on Photomask Technology and Management, 2008
Kwangok Jeong, Andrew B. KahngTiming Analysis and Optimization Implications of Bimodal CD Distribution in Double PatterningProc. Asia and South Pacific Design Automation Conf., 2009
Eric Chin and Andrew NeureutherVariability aware timing models for double patterningSPIE Advanced Lithography 2009
Lynn T.-N. Wang, Liang-Teck Pang, Andrew R. Neureuther, Borivoje NikolicParameter-Specific Electronic Measurement and Analysis of Sources of Variation using Ring OscillatorsSPIE 2009
Lynn T.-N. Wang, Anthony Yeh, Lilly Kem, and Andrew R. NeureutherIllustration of Illumination Effects on Proximity, Focus Spillover, and Design RulesSPIE 2009
Neil Brahma, Mike Chan, Jan TalbotEffect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina ParticlesECS Transactions - San Fransisco, CA" Volume 19, "Chemical Mechanical Polishing 10", 2009
Marshal Miller, Andrew NeureutherAnalysis and Modeling of Photomask Edge Effects for 3D Geometries and the Effect on Process WindowSPIE Advanced Lithography 2009
Kun Qian, Borivoje Nikolic and Costas J. SpanosHierarchical Modeling of Spatial Variability with a 45nm ExampleSPIE Advanced Lithography 2009
Qian Ying Tang and Costas SpanosInterval-value Based Circuit Simulation for Statistical Circuit DesignSPIE Advanced Lithography 2009
Jason Cong, Puneet Gupta, and John LeeOn the Futility of Statistical Power OptimizationDesign Automation Conference, Asian and South Pacific, 2009
Lerong Cheng, Puneet Gupta, and Lei HeAccounting for Non-linear Dependence Using Function Driven Component AnalysisDesign Automation Conference, Asian and South Pacific, 2009
Lerong Cheng, Puneet Gupta, Costas Spanos, Kun Qian, and Lei HePhysically Justifiable Die-Level Modeling of Spatial Variation in View of Systematic Across Wafer VariabilityDesign Automation Conference 2009
John Gerling, Zhongsheng Luo, Vorrada Loryuenyong, and Nathan CheungZERO FOOTPRINT OPTICAL SENSOR CELL FOR IN-SITU MONITORING OF MEMBRANE ABSORPTION/DESORPTION OF LIQUIDSInstitute of Biological Engineering Annual Conference March 19-21, 2009
M.A. LiebermanThe Langmuir Isotherm and the Standard Model of Ion-Assisted EtchingPlasma Sources Sci. Technol. 18, 014002 (2009)
Carlo Novara, Tyrone L. Vincent and Kameshwar PoollaImplementation of Input Design for Structured Nonlinear System Identification via Linear IMC Control15th IFAC Symposium on System Identification, St. Malo, July 6-8, 2009
Tyrone L. Vincent, Carlo Novara, Kenneth Hsu, and Kameshwar PoollaInput Design for Structured Nonlinear System Identification15th IFAC Symposium on System Identification 2009
Justin Ghan, Ning Ma, Sandipan Mishra, Costas Spanos, Kameshwar Poolla, Norma Rodriguez, Luigi CapodieciClustering and pattern matching for an automatic hotspot classification and detection systemSPIE Advanced Lithography 2009
Juliet Rubinstein and Prof. Andrew R. NeureutherThrough-Focus Pattern Matching Applied to Double PatterningSPIE Advanced Lithography 2009
Changhwan Shin, Xin Sun, and Tsu-Jae King LiuStudy of Random Dopant Fluctuation (RDF) Effects for the Tri-Gate Bulk MOSFETTransaction on Electron Devices (accepted, to be published in July 2009)
Rani S. Ghaida and Puneet GuptaDesign-Overlay Interactions in Metal Double PatterningSPIE Advanced Lithography 2009
Juliet Rubinstein and Prof. Andrew R. NeureutherPost-Decomposition Assessment of Double Patterning LayoutSPIE Symposium on Advanced Lithography 2008
Andrew Carlson, Xin Sun, Changhwan Shin, Tsu-Jae King LiuSRAM yield and performance enhancements with tri-gate bulk MOSFETsIEEE 2008 Silicon Nanoelectronics Workshop (Honolulu, HI, USA), June 2008.
Changhwan Shin, Andrew Carlson, Xin Sun, Kanghoon Jeon, Tsu-Jae King LiuTri-gate bulk MOSFET design for improved robustness to random dopant fluctuationsIEEE 2008 Silicon Nanoelectronics Workshop (Honolulu, HI, USA), June 2008.
Cheng-Che Hsu, John Hoang, Vu Le, and Jane P. ChangFeature profile evolution during shallow trench isolation etch in chlorine-based plasmas. II. Coupling reactor and feature scale modelsJournal of Vacuum Science B 26(6), 1919 (2008)
John Hoang, Cheng-Che Hsu, and Jane P. ChangFeature profile evolution during shallow trench isolation etch in chlorine-based plasmas. I. Feature scale modelingJournal of Vacuum Science B
T. Mussenbrock,R.P. Brinkmann,M.A. Lieberman, A.J. Lichtenberg, E. KawamuraEnhancement of Ohmic and stochastic heating by resonance effects in capacitive radio frequency discharges: A theoretical approachPhysical Review Letters Vol. 101, 085004 (2008)
Hai-Yan Jin and Nathan W. CheungA New Method to Extract Bulk Carrier Mobility in Germanium-on-InsulatorIEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 55, NO. 5, MAY 2008
Hai-Yan Jin and Nathan W. CheungForming Gas Annealing Characteristics of Germanium-on-Insulator SubstratesIEEE ELECTRON DEVICE LETTERS, VOL. 29, NO. 7, JULY 2008
Ning Ma, Justin Ghan, Sandipan Mishra, Costas Spanos, and Kameshwar PoollaAutomatic hotspot classification using pattern-based clusteringProc. SPIE / Volume 6925 / Layout Verification, Hotspots, Variations, 2008
D. P. Ceperley, A. R. Neureuther, A. Hawryluk, X. Wang, M. Shen, and Y. WantWavelength and Polarization Dependent Absorbtion Effects in Millisecond Annealing of Metal Gate StructuresIEEE Rapid Thermal Processing 2008 Conference
D. P. Ceperley and A. R. NeureutherEngineering Surface Plasmon Grating Couplers through Computer SimulationJVST B / EIPBN, 2008
A. R. Tao, D. P. Ceperley, P. Sinsermsuksakul, A. R. Neureuther, and P. YangSelf-Organized Silver Nanoparticles for Three-Dimensional Plasmonic CrystalsNano Letters, September 2008
Andrew B. Kahng, Chul-Hong Park, Xu Xu, Hailong YaoLayout Decomposition for Double Patterning LithographyInternational Conference on Computer-Aided Design (ICCAD'08)
Eric Chin, Andrew NeureutherABSTRACT: Variability-aware device and interconnect timing models for double patterningSPIE Advanced Lithography 2009
Jing Xue, Andrew R. Neureuther, Costas J. SpanosPrinting Assessment and Scatterometry Calibration of Probe Pattern Grating Defocus MonitorAECAPC 2008 (Best student paper)
Hai-Yan Jin, Eric Z. Liu and Nathan W. CheungFabrication and Characteristics of Germanium-On-Insulator SubstratesThe 9th International Conference on Solid-State and Integrated-Circuit Technology, October 20-23,2008
E. Kawamura, A.J. Lichtenberg, M.A. LiebermanSecondary electrons in rf and dc/rf capacitive dischargesPlasma Sources Sci. Technol. v.17 045002 (August 2008)
M.A. Lieberman, A.J. Lichtenberg, E. Kawamura,The effects of nonlinear series resonance on Ohmic and stochastic heating in Capacitive DischargesPhysics of Plasmas v.15, 063505 (June 2008)
L.T.-N Wang, W. J. Poppe, L.-T Pang, A. Neureuther, E. Alon, and B. NikolicHyper-sensitive parameter-identifying ring oscillators for lithography process monitoring.SPIE Symposium on Advanced Lithography 2008
L.T.-N. Wang and A. R. NeureutherLateral interactions between standard cells using pattern matchingBACUS 2007
Xin Sun and Tsu-Jae King LiuSpacer Gate Lithography for Reduced Variability Due to Line Edge Roughnesssubmitted to the IEEE Transactions on Semiconductor Manufacturing,2009
R. V. Ihnfeldt and Jan B. TalbotModeling Material Removal Rates for Copper CMP Using Copper Nanohardness and Etch RatesJournal of The Electrochemical Society, 155 (8) H582 (2008)
Puneet Gupta, Kwangok Jeong, Andrew B. Kahng and Chul-Hong ParkElectrical Metrics forLithographic Line-End TaperingPhotomask Japan 2008
Puneet Gupta, Andrew B. Kahng, Y. Kim, S. Shah, D. SylvesterInvestigation of Diffusion Rounding for Post-Lithography AnalysisIEEE/ACM ASPDAC, 2008
Puneet Gupta, Andrew B. Kahng, Y. Kim, S. Shah, D. SylvesterInvestigation of Diffusion Rounding for Post-Lithography AnalysisIEEE/ACM ASPDAC, 2008
Puneet Gupta, Andrew B. Kahng, Y. kim, S. Shah and D. SylvesterShaping Gate Channels for Improved DevicesSPIE Advanced Lithography Symposium, 2008
Andrew R. NeureutherIf it Moves, Simulate It!SPIE Symposium on Advanced Lithography 2008, 6924-1
Marshal Miller, Andrew Neureuther, Daniel Ceperley, Koji KikuchiImpact of photomask quadrature edge effects through focusSPIE Symposium on Advanced Lithography 2008
Eric Chin and Andrew NeureutherModeling Timing Across the Lithographic Process WindowSPIE Symposium on Advanced Lithography 2008
Kun Qian, Costas J. SpanosA Comprehensive Model of Process Variability for Statistical Timing OptimizationSPIE Symposium on Advanced Lithography 2008
Qian Ying Tang, Costas J. SpanosLayout Optimization based on a Generalized Process Variability ModelSPIE Advanced Lithography 2008
Insook Lee, D.B. Graves, and M.A. LiebermanModeling electromagnetic effects in capacitive dischargesPlasma Sources Sci. Technol. vol. 17, 015018 (16pp), 2008
R. V. Ihnfeldt and J. B. TalbotModeling Copper CMP Material Removal Rates Using Copper Surface Nanohardness213th Meeting of the Electrochemical Society, Phoenix, Arizona, May 18-23, 2008.
R. V. Ihnfeldt and J. B. TalbotEffect of CMP Slurry Chemistry on Copper Surface NanohardnessJournal of the Electrochemical Society, vol. 155, pg.6 (2008).
Kedar Patel, Tsu-Jae King Liu, Costas SpanosImpact of Line Edge Roughness on Double-Gate FinFET Performance VariabilitySPIE Symposium on Advanced Lithography 2008
Juliet Rubinstein, Andrew R. NeureutherImages in Photoresist for Self-Interferometric Electrical Image MonitorsBACUS 2007
S. Tripathi, L. Wang F. M. Doyle, and D. A. DornfeldAFM and EQCM study of copper in CMP slurry constituentsInternational Conference on Planarization/CMP Technology, Foster city, CA, Oct 12-13,2006 (Poster Presentation)
S. Tripathi, A. Monvoisin, F. M. Doyle, and D. A. DornfeldCMP Modeling as a part of Design for ManufacturingProceedings of International Conference on Planarization/CMP Technology, Dresden Germany, Oct 25-26, 2007
Shantanu Tripathi, Fiona Doyle, David DornfeldProperties and Mechanical Response of Passive Films formed during Copper CMPPresented at MRS 2007 Spring Meeting, San Francisco, CA, April 2007 (Abstract)
Wojtek Poppe,Patrick Au, Darshana Jayasuriya, and Andrew NeureutherDatabase and Data Analysis Strategy for Multi-Designer TestchipsBACUS (SPIE Photomask conference), 2007
Marshal Miller, Andrew Neureuther, Daniel Ceperley, Juliet Rubinstein, Koni KikuchiCharacterization and monitoring of photomask edge effectsBACUS 2007
E. Kawamura, M.A. Lieberman, A.J. LIchtenberg, E.A. HudsonCapacitive Discharges Driven by Combined DC/RF SourcesJournal of Vacuum Science and Technology A, vol. 25, p. 1456 (S/Oct. 2007)
Paul Friedberg, Willy Ceung, George Cheng, Qian Ying Tang, Costas J. SpanosModeling Spatial Gate Length Variation in the 0.2um to 1.15mm Separation RangeSPIE 2007
Jing Xue, Costas J. Spanos, and Andrew R. NeureutherPrinting Assessment of Parameter Specific Phase-Shift-Mask Patterns for Scatterometry Monitoring (Abstract)SPIE Symposium on Advanced Lithography 2008
Jing Xue, Yu Ben, Chaohao Wang, Marshal Miller, Costas J. Spanos and Andrew R. NeureutherParameter Sensitive Patterns for Scatterometry MonitoringSPIE BACUS 2007
Jing Xue, and Costas J. SpanosAn intergrated Aerial Image Sensor for Lithography DiagnosticsInternational workshop on electron devices and semiconductor technology (IEDST), 2007
Jing Xue, Kurt Moen, Costas SpanosIntegrated aerial image sensor: design, modeling and assemblyJ. Vac. Sci. Technol., B 24(6), pp3088, 2006
Yu Ben, Jing Xue and Costas J. SpanosUsing Dual-pitch Gratings for Optical System Characterization through ScatterometrySPIE Symposium on Advanced Lithography 2008
R. V. Ihnfeldt and J. B. TalbotModeling of Copper CMP Using the Colloidal Behavior of an Alumina Slurry with Copper NanoparticlesJournal of the Electrochemical Society, 154, (12) H1018 (2007)
R. V. Ihnfeldt and J. B. TalbotCopper CMP Removal Rate Predictions Using Alumina Agglomerate Size DistributionsVLSI Multilevel Interconnection Conference (VMIC), September 25-27, 2007, Fremont, California
Juliet Rubinstein, Andrew R. NeureutherABSTRACT: Images in Photoresist for Self-Interferometric Electrical Image MonitorsBACUS 2007
Cain, J.P., Naulleau, P.P., Gullikson, E. M., and Spanos, C.J.Lithographic Characterization of the Flare in the Berkeley 0.3 Numerical Aperture Extreme Ultraviolet Microfield OpticJ. Vac. Sci. Technol. B, v. 24, n. 3, pp. 1234-7, May/June 2006
R. Ihnfeldt and J. B. TalbotCopper Removal Rate Predictions Using Alumina Agglomerate Size Distribution and Copper Nanohardness MeasurementsInternational Conference on Planarization/CMP Technology, Foster city, CA, Oct 12-13, 2006
Qiaolin Zhang, C. Tang, J. Cain, A. Hui, T. Hsieh, N. Maccrae, B. Singe, K. Poolla, and C. SpanosAcross-wafer CD uniformity control through lithography and etch process: experimental verificationProceedings of SPIE vol. 6518, 2007
Qian Ying Tang, Paul Friedberg, George Cheng, and Costas J. SpanosCircuit size optimization with multiple sources of variation and position-dependent correlationProceedings of SPIE vol. 6521, 2007
Paul Friedberg, Willy Cheung, George Cheng, Qian Ying Tang, and Costas J. SpanosModeling spatial gate length variation in the 0.2um to 1.15mm separation rangeProceedings of SPIE vol. 6521, 2007
Cain, J.P., Naulleau, P.P., Gullikson, E. M., and Spanos, C.J.Lithographic Characterization of the Flare in the Berkeley 0.3 Numerical Aperture Extreme Ultraviolet Microfield OpticJ. Vac. Sci. Technol. B, v. 24, n. 3, pp. 1234-7, May/June 2006.
E. Chin, J. Holwill, and A. NeureutherPrediction of Interconnect Delay Variations Using Pattern MatchingProceedings of the SPIE, vol 6521(16), 2007.
Juliet Holwill, Andrew R. NeureutherDRC and Mask Friendly Pattern and Probe Aberration MonitorsSPIE 2007
R. Ihnfeldt and J. B. TalbotEffects of CMP Slurry Chemistry on Agglomeration of Alumina and Copper Surface HardnessThe 210th Meeting of the Electrochemical Society, Cancun, Mexico, Oct. 29-Nov. 3, 602, 1147 (2006).
Alan C.F. Wu, M.A. Lieberman, and J.P. VerboncoeurA Method for Computing Ion Energy Distributions for Multifrequency Capacitive DischargesJournal of Applied Physics, vol. 101, 056105 (2007)
Sungjin Kim, Zhuwen Zhou, M.A. Lieberman, and A.J. LichtenbergRelaxation Oscillations in a Capacitive Discharge Chamber Connected to a Peripheral Grounded ChamberJournal of Applied Physics, vol. 100, 103302 (2006)
J.Choi,S.Tripathi,D.Hansen, and D.A.DornfeldChip Scale Prediction of Nitride Erosion in High Selectivity STI CMPProceedings of 2006 CMP-MIC, Fremont,CA,2006
J.Choi, D.A.Dornfeld and D.HansenIntegrated Model-based Simulation for HDP-CVD Topography and Highly Selective CMP for STI Process OptimizationInternational Conference on Planarization/CMP Technology, Foster city,CA,Oct 12-13,2006
Gregory McIntyreCharacterizing Polarized Illumination in High Numerical Aperture Optical Lithography with Phase Shifting MasksUC Berkeley Ph.D. Dissertation, May 2006
Gregory McIntyre, Garth Robins, and Andrew NeureutherPhase shifting mask as a precision instrument for characterizing image-forming optical systemsSPIE Optics and Photonics, Aug 2005
Gregory McIntyre, Andrew Neureuther, Venu Vellenki and Patrick ReynoldsExperimental verification of PSM Polarimetry: Monitoring polarization at 193nm high-NA with phase shift masksSPIE Microlithography, Feb 2006
Gregory McIntyre and Andrew NeureutherThe effect of the photomask on multiphase shift test monitorsSPIE (BACUS), Sept 2006
Gregory McIntyre and Andrew NeureutherPSM Polarimetry: Monitoring polarization at 193nm high-NA and immersion with phase shifting masksJournal of Microlithography, Microfabrication, and Microsystems, vol. 4(3) (Jul-Sep 2005)
Greg McIntyre, Juliet Holwill, Andrew Neureuther, Luigi Capodieci, Yi Zou, Harry Levinson, and Jongwook KyeScreening layouts for high-NA polarization effects using pattern matchingJ. Vac Sci. Technol. B, vol. 23(6) (Oct 2005)
Gregory McIntyre and Andrew NeureutherPhase shift mask interferometric birefringence monitorJournal of Vacuum Science and Technology (EIPBN 2006)
Gregory McIntyre, Jongwook Kye, Harry Levinson, and Andrew NeureutherPolarization Aberrations in ultra high numerical aperture projection printing: A comparison of various representationsJournal of Microlithography, Microfabrication, and Microsystems, vol. 5(3) (Jul-Sep 2006)
Qiaolin(Charlie) Zhang, Kameshwar Poolla, Costas SpanosAcross Wafer Post Etch CD Uniformity Enhancement through Model Based ControlAEC/APC 2006
H. Bracht, H.H. Silvestri, I.D. Sharp, and E. E. HallerSelf- and foreign-atom diffusion in semiconductor isotope heterostructures Part II: Experimental results for siliconPhysical Review B (Condensed Matter and Materials Physics), vol. 75, pp. 035211, 2007
Jing Xue, Kurt Moen, Costas SpanosIntegrated aerial image sensor: Design, modeling, and assemblyaccepted by JVST B 2006
Sungjin Kim, Lieberman MA, Lichtenberg AJ, Gudmundsson JTImproved volume-averaged model for steady and pulsed-power electronegative dischargesJournal of Vacuum Science and Technology A, Vol.24, 2025 (2006)
Eric Liu, Vorarda Loryuenyong, and Nathan W CheungRecent Progress of Heterogeneous INtegration for Semiconductor Materials and MicrosystemsProceedings of 8th International Conference on Solid-State and Integrated Circuit Technology, C2.1 (2006)
Vorrada Loryuenyong and Nathan W CheungSi and SiO2 layer transfer induced by residual mechanical stressApplied Physics Letters, 88, 132103 (2006)
Vorrada LoeyuenyongPaste-and-Cut Integration of Advanced Semiconductor MaterialsUC Berkeley Ph.D. Thesis 2006
Cheng-Che Hsu, MA Nierode, JW Coburn and DB GravesComparison of model and experiment for Ar, Ar/O2, and Ar/O2/Cl2 inductively coupled plasmasJ. of Physics D (July 2006)
Juliet Holwill, Andrew R. NeureutherSelf Interferometric Electrical Image MonitorsSPIE 2006
Juliet Holwill, Gregory McIntyre, Wojtek Poppe and Andrew R. NeureutherLayout 'Hot Spots' for Advancing Optical TechnologiesSPIE 2006
R. Ihnfeldt and J. B. TalbotThe Effects of Copper CMP Slurry Chemistry on the Colloidal Behavior of Alumina AbrasivesJournal of the Electrochemical Society, 153, 11 G948 (2006)
P Chabert, J-L Raimbault, P Levif, J-M Rax, and M A LiebermanInductive heating and E to H transitions in high frequency capacitive dischargesPlasma Sources: Science and Technology vol. 15, pp. S130-S136, (April 2006)
M A Lieberman, A J Lichtenberg, Sungjin Kim, J T Gudmundsson, D L Keil, and Jisoo KimPlasma ignition in a grounded chamber connected to a capacitive dischargePlasma Sources Sci. Technol. 15 (2006) 276-287
E. Kawamura, M. A. Lieberman, and A. J. LichtenbergStochastic heating in single and dual frequency capacitive dischargesPhysics of Plasmas, vol. 13, p. 053506 1-14, (May 2006)
Shantanu Tripathi, Fiona Doyle, David DorfeldTribo-Chemical Modeling of Copper CMPVMIC 2006
H H Silvestri, H Bracht, J Lundsgaard Hansen, A Nylandsted Larsen and E E HallerDiffusion of silicon in crystalline germaniumSemicond. Sci. Technol. 21 758-762 (April 2006)
P. Chabert, J.-L. Raimbault, P. Levif, J.-M. Rax, and M.A. LiebermanInductive Heating and E to H Transitions in Capacitive DischargesPhysical Review Letters, vol. 95, 205001 (2005)
Ling Wang and Fiona M. DoyleUse of an Electrochemical Quartz Crystal Microbalance (EQCM) to Elucidate the Adsorption of Glycine and Hydrogen Peroxide on Copper SurfacesProceedings Tenth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnections, February 22-25, 2005
Hartmut A. Bracht, Hughes H. Silvestri, and Eugene E. HallerAdvanced Diffusion Studies with Isotopically Controlled MaterialsSolid State Comm. 133, 727-35 (2005)
H. H. Silvestri, E.E. Haller, H. Bracht, J. Lundsgaard Hansen, A. Nylandsted LarsenDiffusion of Silicon in GermaniumProc. 27th Intl. Confr. on the Physics of Semiconductors (ICPS-27), July 26-30, 2004, Flagstaff, AZ; J. Menéndez and C. G. Van de Walle, eds., AIP Confr. Proc. 772, 97-8 (2005).
Jing Xue, Kurt Moen, and Costas SpanosIntegrated Aerial Image Sensor: Concept, Design and ModelingAEC/APC 2005
Jing Xue, Costas SpanosDesign of an integrated aerial image sensorProc. of SPIE, Vol. 5752, pp.392, 2005
Qiaolin Zhang, Paul Friedberg, Kameshwar Poolla, Costas SpanosEnhanced Spatial PEB Uniformity through a Novel Bake Plate Design Plate DesignAEC/APC XVII 2005. (Win Best Student Paper Award )
Sunghoon Lee ,Hyoungjae Kim, and David DornfeldDevelopment of a CMP pad with controlled micro features for improved performance2005 International Symposium of Semicoductor Manufacturing
Qiaolin Zhang, Kameshwar Poolla, Costas J. SpanosModeling of Mask Thermal Distortion and Its Dependency on Pattern DensityPhotomask Japan 2005
Eric Z.X.Liu, Vorrada Loryuenyong, Nathan W. Cheung;B.Schmidt,P.Chen,S.S. Laulayer transfer and characterization of SOI and GeOI substrates8th international symposium on semiconductor wafer bonding: science,technology and applications,ECS meeting,May15,2005
Jihong Choi and D.A.DornfeldChip Scale Topography Evolution Model for CMP Process OptimizationProc. of International Syposium on Semicondutor Manufacturing (ISSM) 2005, Sept 13-15, San Jose, CA
Gregory R. McIntyre, Juliet Holwill, Andrew Neureuther, Luigi Capodieci, Yi Zou, Harry Levison, Jongwook KyeScreening Layouts for High-NA Polarization Effects Using Pattern MatchingEIPBN May 2005
Andrew R. Neureuther, G. Robins, and G. McIntyrePhase-Shifting Mask Technology as a Precision Instrument for Diagnosis and Control in OphthalmologyARVO 2005 (slides only)
A.R. Neureuther, R.F.W. Pease, L. Yuan, K. Baghhani Parizi, H. Esfandyarpour, W.J. Poppe, J.A. Liddle and E.H. AndersonShot noise models for sequential processes and the role of lateral mixingEIPBN May 05
Garth Charles RobinsInterferometric Pattern and Probe-Based Aberration Monitorsdissertation
Qiaolin Zhang, Cherry Tang, Tony Hsieh, Nick Maccrae,Bhanwar Singh, Kameshwar Poolla, Costas SpanosComprehensive CD Uniformity Control across Lithography and EtchSPIE 2005 Microlithography
Greg McIntyre, Andrew NeureutherPSM Polarimetry: Monitoring Polarization at 193nm High-NA and Immersion with Phase Shifting MasksSPIE Microlithography 2005
Jihong Choi, D.E.Lee and D.A.DornfeldIn-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP2005 Proc.of CMP for ULSI Multilevel Interconnection Conference (CMP-MIC), Feb 23-25, 2005,Fremont, CA
Sunghoon Lee, Hyoungjae Kim, David DornfeldPerformance of a novel controlled-contact area pad for CMP2005 Electrochemical Society spring meeting, Quebec, Canada, May 2005
Sunghoon Lee, Hyoungjae Kim, David DornfeldDesign rules for CMP pad based on pad-characterization and its prototype fabrication using micro molding2005 CMP-MIC, Fremont, Feb, 2005
Paul FriedbergModeling Within-Die Spatial Correlation Effects for Process-Design Co-Optimization
H. H. Silvestri, I. D. Sharp, H. Bracht, J. Hansen, A. Nylandsted-Larsen, and E. E. Haller“Simultaneous Phosphorus and Si Self-Diffusion in Extrinsic Silicon Isotopically Controlled Heterostructures”MRS Spring 2004 Symp. C, talk C3.3, April 12-16, 2004, San Francisco; Mat. Res. Soc. Symp. Proc. Vol. 810, 77-83 (2004).
Greg McIntyre, Andrew NeureutherMonitoring Polarization and High NA with Phase Shifting Masks: Radial Phase GratingJ. Vac. Sci. Tech, B (EIPBN)
Greg McIntyre, Andrew NeureutherInitial Experimental Verification: Characterizing Tool Illumination and PSM Performance with Phase Shifting MasksSPIE Microlithography, 2004
Patrick Naulleau, Kenneth A. Goldberg, Erik Anderson, Jason P. Cain, Paul Denham, Keith Jackson, Anne-Sophie Morlens, Seno Rekawa, Farhad SalmassiExtreme ultraviolet microexposures at the Advanced Light Source using the 0.3 numerical aperture micro-exposure tool opticJournal of Vacuum Science and Technology B
Ling Wang and Fiona M. DoyleApplication of an Electrochemical Quartz Crystal Microbalance (EQCM) to Study the Interaction between Copper and Copper CMP Slurry Components9th CMP Users Group Annual Symposium, San Jose, CA
Jihong Choi, David DornfeldModeling of Pattern Density Dependent Pressure Non-uniformity at a Die Scale for ILD Chemical Mecanical PlanarizationProceedings of 2004 MRS Spring meeting
Ling Wang and Fiona M. DoyleKnown effects of pattern characteristics on copper CMP and future directionsNinth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnections, Marina Del Rey, California
Sunghoon Lee, David DornfeldMicro feature pad development and its performance2004 MRS spring meeting
Sunghoon Lee, David DornfeldPAD CONTACT AREA CHARACTERIZATION IN CHEMICAL MECHANICAL PLANARIZATIONUSING MICRO MOLDING TECHNOLOGY18th American Society of Precision Engineering
Serdar Aksu, Ling Wang and Fiona M. DoyleEffect of hydrogen peroxide on the oxidation of copper in CMP slurries containing glycineJournal of the Electrochemical Society, 150 (11) (2003) pp. G718-G723.
Hughes Silvestri and Eugene HallerSimultaneous Phosphorus and Si Self-Diffusion in Extrinsic, Isotopically Controlled Silicon HeterostructuresMaterials Research Society, Spring 2004 Proceedings
P. Chabert, J.L. Raimbault, J.M. Rax, and M.A. LiebermanSelf-Consistent Nonlinear Transmission Line Model of Standing Wave Effects in a Capacitive DischargePhysics of Plasmas, vol. 11, no. 5, pp. 1775-85, May 2004
Qiaolin(Charlie) Zhang, Paul Friedberg, Cherry Tang, Bhanwar Singh, Kameshwar Poolla, Costas SpanosAcross-wafer CD Uniformity Enhancement through Control of Multi-zone PEB ProfilesMicrolithography, SPIE 2004